عنوان مقاله [English]
Copper thin films are widely used in security sensors, medical sensors, solar panels, mode locked laser, cancer treatment, and so on. Thermal evaporation is a common technique for deposition of copper thin
films. The distance between the copper source and the substrate is an important parameter that has not been investigated yet. Therefore, the effect of this parameter on the process of copper thin film deposition by thermal evaporation is investigated theoretically in this paper. The results showed that the copper vapor pressure on the substrate surface, the deposition rate and the thickness of the thin layer decreased with increasing this distance, whereas the uniformity of the film thickness improved with increasing the distance. The deposition rate decreased from 5.57nm/s to 1.12 nm/s and the thickness uniformity increases from 56 nm to 120 nm with increasing distance from 13 cm to 33 cm. Also, the dependence of thickness uniformity and deposition rate on the source-to-substrate distance was presented to select the appropriate distance according to the application of the thin layer.